Sputtering Deposition Rate of Different Targets Under Different Conditions

As a key parameter affecting the quality, thickness uniformity and performance of the film, the sputtering rate is affected by many factors, including target type, vacuum degree, working gas pressure, power supply, magnetic field strength and so on. A thorough understanding of the influence of these factors on the sputtering rate is of great significance for optimizing the process parameters and improving the quality of the film.