4-Inch Aluminum Target Magnetron Sputtering Process Demonstration

This process demonstrates magnetron sputter deposition using a 4-inch high-purity aluminum target. After the substrates are cleaned and loaded, the chamber is evacuated to the required process vacuum.

High-purity argon is then introduced to ignite the plasma. Pre-sputtering is performed at 300 W to remove oxides and contaminants from the target surface.

Once the discharge stabilizes, the shutter is opened. Under argon-ion bombardment, aluminum atoms are ejected from the target surface and gradually deposited onto the substrates, forming a uniform, dense aluminum thin film.

By precisely controlling the vacuum level, gas flow rate, sputtering time, and target-to-substrate distance, an aluminum film with excellent uniformity and adhesion can be achieved.