Engineer Zhao
1. Juli 2026
The VPI SD-650MH High-Vacuum Dual-Target Dual-RF Sputter Coater is equipped with dual target positions and dual RF power supplies, supporting independent or combined deposition of two different target materials. It is suitable for R&D of metal oxides, nitrides, dielectric films, semiconductor films, transparent conductive films, sensor functional layers, electrode layers, and multilayer composite films.
The VPI SD-650MH High-Vacuum Dual-Target Dual-RF Sputter Coater is equipped with dual target positions and dual RF power supplies, supporting independent or combined deposition of two different target materials. It is suitable for R&D of metal oxides, nitrides, dielectric films, semiconductor films, transparent conductive films, sensor functional layers, electrode layers, and multilayer composite films.
For process applications, the system can perform basic thin-film deposition through single-target sputtering, while its dual-target configuration also enables alternating deposition, multilayer film construction, and co-sputtering experiments. This helps users control film thickness, composition ratio, and interface structure.
The dual-RF configuration is especially suitable for depositing insulating targets and high-resistance materials, such as aluminum oxide, silicon dioxide, silicon nitride, zinc oxide, ITO, and other dielectric or functional materials. Combined with a high-vacuum environment and gas flow control, users can further explore Ar sputtering, Ar/O₂ reactive sputtering, Ar/N₂ reactive sputtering, and other processes, supporting a complete R&D workflow from material screening and parameter optimization to small-sample preparation.
