VPI High Vacuum Magnetron Sputtering System Installed in the Shared Laboratory of the School of Physics and Astronomy, Shanghai Jiao Tong University

Instrument Overview

The SD-650MH magnetron sputtering system is known for its high vacuum capability and user-friendly operation. It consists of a sputtering vacuum chamber, magnetron sputtering target, rotating sample stage, working gas lines, vacuum pumping system, vacuum gauges, and an integrated control system. Equipped with both DC and RF power supplies, the instrument supports the deposition and research of a wide range of thin-film materials, including metals, semiconductors, and insulators.

Compact in size yet powerful in performance, this high vacuum magnetron sputtering device can achieve an ultimate vacuum of 5×10⁻⁵ Pa, and is capable of sputtering various materials using DC or RF sources. As part of a shared research platform, it provides researchers with a fundamental and reliable thin-film fabrication tool, enabling the development of advanced materials and devices. With this system, researchers can complete high-quality thin film deposition in-house, reducing dependence on outsourcing and accelerating project timelines.

Significance of Shared Laboratory Platforms

Shared laboratories at universities play an increasingly vital role in advancing scientific research. The Micro-Nano Fabrication and Characterization Platform at the School of Physics and Astronomy, SJTU, is a prime example. This platform integrates a wide array of cutting-edge instruments and is open to users both within and beyond the university. It offers accessible experimental environments and technical support for researchers, while also emphasizing student training. Through standardized management and hands-on technical instruction, students gain experience operating advanced scientific instruments, enhancing their practical skills and innovation capacity. The shared-use model maximizes equipment utilization, fosters interdisciplinary collaboration, and helps generate a greater volume of innovative research outcomes.

Technical Specifications

• Ultimate vacuum: 5×10⁻⁵ Pa

• Chamber size: 260 mm (diameter) × 280 mm (height)

• Sputtering target size: 50 mm (diameter)

• Cooling method: Air-cooled (pump) + Water-cooled (sputtering target)

• Vacuum gauges: Thermocouple gauge, ionization gauge

• DC power supply: Adjustable 0–300 W

• RF power supply: Adjustable 0–300 W

Typical Applications

• Suitable for the deposition of various electrical and optical thin films.

• Since magnetron sputtering does not require thermal melting, it is especially useful for depositing high-melting-point materials that are difficult or impossible to evaporate using thermal methods.

• Currently available target materials include Cu, Au, Ni, Pt, C, and Fe₃O₄. For other materials, please contact the platform.

Sample Requirements

• Maximum sample diameter or side length: 120 mm